TSM-DS3 PCB built on 30mil material | fabricating large format complex multilayers with Immersion Gold for RF microwave

TSM-DS3 PCB: 2-Layer, 30mil Core, 0.8mm Thickness with Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

Overview of TSM-DS3 2-Layer PCB

The TSM-DS3 PCB is a high-performance 2-layer rigid PCB designed for high-power, low-loss, and thermally stable applications. Built with TSM-DS3 materials, this PCB features a 30mil (0.762mm) core and a finished thickness of 0.8mm, providing low dielectric loss and excellent thermal conductivity.

With a dielectric constant (Dk) of 3.0 ± 0.05 and dissipation factor (Df) of 0.0014 at 10 GHz, the TSM-DS3 PCB is a reliable choice for radar systems, phased array antennas, and high-frequency automotive applications. The Immersion Gold (ENIG) surface finish ensures excellent solderability, corrosion resistance, and long-term durability.

PCB Construction Details

PCB Stackup

Introduction to TSM-DS3 Material

The TSM-DS3 laminates are ceramic-filled, reinforced materials with minimal fiberglass content (~5%), developed for high-power RF applications. These materials provide dimensional stability, low loss, and thermal reliability, combining the benefits of ceramics and traditional epoxy laminates.

Key Features of TSM-DS3

Dielectric Constant (Dk): 3.0 ± 0.05 at 10GHz / 23°C.

Dissipation Factor (Df): Low at 0.0014 at 10GHz.

Thermal Conductivity: 0.65 W/m·K for optimal heat dissipation.

Moisture Absorption: Extremely low at 0.07%.

CTE (Coefficient of Thermal Expansion): X-axis: 10 ppm/°C. Y-axis: 16 ppm/°C. Z-axis: 23 ppm/°C.

Temperature Stable Dk: ±0.25% from -30°C to 120°C.

Benefits of TSM-DS3

• Dimensional Stability: Rivals epoxy for large-format multilayer PCBs.
• Low Dielectric Loss: Suitable for high-frequency, low-loss designs.
• Thermal Stability: High thermal conductivity ensures reliable performance under high-power conditions.
• High Yield and Consistency: Compatible with standard PCB manufacturing processes.
• Resistive Foil Compatibility: Supports advanced circuit designs.

Applications

Couplers

Phased Array Antennas

Radar Manifolds

Millimeter Wave Antennas

Automotive Applications

Oil Drilling Equipment

Semiconductor/ATE Testing

Conclusion

The TSM-DS3 2-layer PCB is a premium solution for high-frequency, high-power PCB designs, offering low dielectric loss, thermal stability, and dimensional reliability. With its 30mil TSM-DS3 core, Immersion Gold finish, and green solder mask, this PCB is ideal for applications such as radar manifolds, phased array antennas, and semiconductor testing.

Compliant with IPC-Class-2 standards and available worldwide, the TSM-DS3 PCB is the perfect choice for engineers seeking cost-effective, high-performance materials for complex, high-frequency designs.