Wangling’s TFA300 high frequency material utilizes special nano-ceramics mixed with PTFE resin for airborne radar

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TFA300 High Frequency PCB

Introduction

Wangling’s TFA300 high frequency material utilizes a large amount of uniform special nano-ceramics mixed with PTFE resin, eliminating the fiberglass effect during the propagation of electromagnetic waves.

A new manufacturing process is employed to create prefabricated sheets, which are pressed using a special lamination process. This material exhibits outstanding electrical, thermal, and mechanical properties with excellent dielectric constant at the same level, making it an aerospace-grade high-frequency and high-reliability material that can replace similar foreign products.

Features

TFA300 features a low dielectric constant of 3 at 10GHz, enabling minimal signal delay and optimal impedance control for high-speed/high-frequency applications (e.g., 5G, radar, mmWave circuits).

Ultra-low dissipation factor of 0.001 at the same frequency ensures minimal signal loss and high-quality signal integrity in RF/microwave PCBs and antennas.

It also features a great TCDk value of -8 PPM/℃,providing exceptional dielectric constant stability across a wide temperature range (-40°C to +150°C), critical for automotive, aerospace, and outdoor telecom systems.

The peel strength is greater than 1.6N/mm, indicating superior adhesion between copper layers and substrate, reducing delamination risks in multilayer PCBs.

18 PPM/ºC of X/Y axis CTE, closely matching copper’s CTE of 17 ppm/°C, minimizes the stress-induced warpage during thermal cycling. 30 ppm/°C of Z axis, balances rigidity and flexibility for reliable plated through-hole (PTH) integrity.

TFA300 also shows low water absorption of 0.04%, a higher thermal conductivity of 0.8W/MK.

Finally, it meets the flammability standard of UL-94 V-0.

PCB Capability

We specialize in delivering high-quality TFA300 PCBs tailored to meet your diverse design and performance requirements.

Layer Count: We can provide you with Single-sided, Double-sided, Multi-layer and Hybrid PCBs (mixed materials).

Copper Weight: You can choose 1oz (35µm) for standard signal integrity, or 2oz (70µm) for enhanced current-carrying capacity and thermal management.

Dielectric Thickness: We offer extensive options from 5mil (0.127mm) to 250mil (6.35mm), enabling precise impedance control and adaptability for high-frequency applications.

PCB Size: We can supply a large panel up to 400mm x 500mm with single board or multiple designs.

Solder Mask Colors: It’s available in Green, Black, Blue, Yellow, Red, and more.

Surface Finishes: Immersion Gold (ENIG), HASL (Lead-Free),Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare copper and Pure Gold are available in house.

Applications

TFA300 PCBs are typically used in aerospace and aviation equipment, phase-sensitive antennas, airborne radar, Satellite communication, and navigation etc.

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