DiClad® 527 double sided Copper-Clad Laminate 1 oz (35µm) with 0.508mm 0.762mm 1.524mm RF Applications

DiClad® 527 Copper-Clad Laminate: Engineered for Superior Stability in Demanding RF Applications

We proudly offer the DiClad® 527, a high-performance woven fiberglass/PTFE laminate engineered by Rogers Corporation to deliver exceptional dimensional stability and reliable electrical properties for critical RF and microwave circuits. As part of the esteemed DiClad series, this material is specifically formulated with a higher fiberglass-to-PTFE ratio, providing mechanical characteristics that approach conventional FR-4 substrates(https://www.circuitboardpcbs.com/sale-14172345-pcb-spacer-fr-4-spacer-block-space-bar-on-1-5mm-fr4-with-drill-holes.html) while maintaining the superior high-frequency performance of PTFE-based materials.

Unmatched Dimensional Stability and Uniformity
The key advantage of DiClad 527 lies in its precision-woven fiberglass reinforcement. Unlike non-woven composites, this controlled structure offers far greater dimensional stability, minimizing movement during thermal cycles and multilayer lamination processes. This translates directly into higher manufacturing yields, improved layer-to-layer registration, and more predictable final board geometries. The uniform, cloth-based construction also ensures excellent dielectric constant (Dk) uniformity across the panel, which is critical for the consistent performance of sensitive components like filters, couplers, and low-noise amplifiers.

Balanced Electrical and Thermal Performance
DiClad 527 is designed for applications where stability and low loss are paramount. It offers a dielectric constant in the range of 2.40 to 2.60 (at 10 GHz) and a low dissipation factor of 0.0017. This combination provides controlled impedance and minimal signal attenuation for power dividers, combiners, and other passive components. The material exhibits a low thermal coefficient of Dk (-153 ppm/°C) and a favorable, low in-plane Coefficient of Thermal Expansion (CTE) of 14 ppm/°C (X-axis) and 21 ppm/°C (Y-axis). This closely matches the CTE of copper, reducing stress on plated through-holes and enhancing long-term reliability in temperature-cycling environments.

Robust Mechanical and Environmental Reliability
Engineered for durability, DiClad 527 features strong mechanical properties, including high Young's modulus and compressive strength. It provides reliable copper peel strength of 14 lbs/in and exhibits very low moisture absorption (0.03%), ensuring performance integrity in humid conditions. The laminate meets NASA outgassing requirements (with very low TML and CVCM) and carries a UL 94 V-0 flammability rating, making it suitable for aerospace, defense, and other high-reliability applications.

Standard Product Configurations

Thicknesses: 0.020" (0.508mm), 0.030" (0.762mm), and 0.060" (1.524mm), all with a tight tolerance of ±0.0020".

Panel Sizes: 12" x 18" (305mm x 457mm), 18" x 12" (457mm x 305mm), 18" x 24" (457mm x 610mm), and 24" x 18" (610mm x 457mm).

Standard Cladding: Supplied with electrodeposited copper foil in standard weights of ½ oz (18µm) and 1 oz (35µm).

Ideal Application Areas
DiClad 527 is the substrate of choice for:

Filters, Couplers, and Hybrids requiring precise electrical performance.

Low-Noise Amplifiers (LNAs) and Power Dividers/Combiners.

Aerospace and Defense Electronics where dimensional stability is critical.

Multilayer Boards benefiting from its low Z-axis CTE and stability.

For engineers who cannot compromise on mechanical stability or electrical consistency, DiClad 527 provides a proven, high-reliability foundation. Contact our sales team today to discuss your project requirements, request detailed data, or place an order. We are here to supply the material performance your most demanding designs require.