logo
prodotti
Dettagli dei prodotti
Casa. > prodotti >
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask

RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask

MOQ: 1 pz
prezzo: 0.99-99USD/PCS
imballaggio standard: Imballaggio
Periodo di consegna: 2-10 giorni lavorativi
metodo di pagamento: T/T, PayPal
Capacità di approvvigionamento: 50000 pezzi
Informazione dettagliata
Luogo di origine
Cina
Marca
Rogers
Certificazione
ISO9001
Numero di modello
RO3010
Tipo di scheda:
PCB a 4 strati
Esame:
E-prova
Dimensione minima del foro:
0.2 mm
colore di seta:
Bianco
Serigrafia del prodotto:
Bianco, Nero, Giallo
Distanza minima tra le tracce:
0.1 mm
Metodo di spedizione:
DHL/FedEx/UPS
Materiale di base:
Spessore da acciaio inossidabile
Min. Traccia/Spazio:
0.1 mm
Colore di Coverlay:
Nero
Assistenza clienti:
Assistenza clienti 24 ore su 24
Peso di rame:
1OZ
Numero di strati:
4
Maschera di saldatura:
Verde
Piattaforma:
Sulla base web
Quantità di ordine minimo:
1 pz
Prezzo:
0.99-99USD/PCS
Imballaggi particolari:
Imballaggio
Tempi di consegna:
2-10 giorni lavorativi
Termini di pagamento:
T/T, PayPal
Capacità di alimentazione:
50000 pezzi
Descrizione del prodotto

RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask
 
 
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
 
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 0
 
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
 
 
2. PCB Construction Details

ParameterSpecification
Base MaterialRogers RO3010
Layer Count4 layers
Board Dimensions35mm x 42mm
Minimum Trace/Space6/9 mils
Minimum Hole Size0.4mm
Via TypeBlind vias (L1-L2)
Finished Board Thickness2.7mm
Finished Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Tin
Top Solder MaskNone
Bottom Solder MaskNone
Top SilkscreenNone
Bottom SilkscreenNone
Electrical Testing100% tested to IPC-Class-2 standards

 
 
 
3. PCB Stackup

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 2Copper (1oz)35 μm
Bonding LayerPrepreg 1060 x 10.05mm
Copper Layer 3Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 4Copper (1oz)35 μm

 
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 1
 
4. Key Features of Rogers RO3010
 

  • Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, enabling efficient circuit miniaturization.
  • Dissipation Factor (Df): 0.0022 at 10 GHz, ensuring minimal signal loss.
  • Thermal Stability:
  • Decomposition Temperature (Td) > 500°C for reliability in high-heat environments.
  • Thermal Conductivity: 0.95 W/mK for effective heat dissipation.
  • Dimensional Stability:
  • Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z), ensuring compatibility with copper.
  • Moisture Absorption: 0.05%, making it reliable in humid conditions.

 
 
 
5. Applications of the 4-Layer PCB

  • Automotive Radar Systems
  • Global Positioning Satellite (GPS) Antennas
  • Cellular Telecommunications Systems
  • Patch Antennas for Wireless Communications
  • Satellite Communications
  • Remote Meter Readers
  • Power Backplanes

 
 
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
 
 
 
What Sets Us Apart?

  1. High Standards: All PCBs are produced to IPC-Class-2 standards and undergo rigorous testing to ensure quality.
  2. Global Availability: We deliver worldwide, ensuring timely support for your projects.
  3. Customer Support: We work closely with clients to provide customized solutions for their specific needs.

 
 
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!
 

Prodotti raccomandati
prodotti
Dettagli dei prodotti
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask
MOQ: 1 pz
prezzo: 0.99-99USD/PCS
imballaggio standard: Imballaggio
Periodo di consegna: 2-10 giorni lavorativi
metodo di pagamento: T/T, PayPal
Capacità di approvvigionamento: 50000 pezzi
Informazione dettagliata
Luogo di origine
Cina
Marca
Rogers
Certificazione
ISO9001
Numero di modello
RO3010
Tipo di scheda:
PCB a 4 strati
Esame:
E-prova
Dimensione minima del foro:
0.2 mm
colore di seta:
Bianco
Serigrafia del prodotto:
Bianco, Nero, Giallo
Distanza minima tra le tracce:
0.1 mm
Metodo di spedizione:
DHL/FedEx/UPS
Materiale di base:
Spessore da acciaio inossidabile
Min. Traccia/Spazio:
0.1 mm
Colore di Coverlay:
Nero
Assistenza clienti:
Assistenza clienti 24 ore su 24
Peso di rame:
1OZ
Numero di strati:
4
Maschera di saldatura:
Verde
Piattaforma:
Sulla base web
Quantità di ordine minimo:
1 pz
Prezzo:
0.99-99USD/PCS
Imballaggi particolari:
Imballaggio
Tempi di consegna:
2-10 giorni lavorativi
Termini di pagamento:
T/T, PayPal
Capacità di alimentazione:
50000 pezzi
Descrizione del prodotto

RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask
 
 
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
 
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 0
 
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
 
 
2. PCB Construction Details

ParameterSpecification
Base MaterialRogers RO3010
Layer Count4 layers
Board Dimensions35mm x 42mm
Minimum Trace/Space6/9 mils
Minimum Hole Size0.4mm
Via TypeBlind vias (L1-L2)
Finished Board Thickness2.7mm
Finished Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Tin
Top Solder MaskNone
Bottom Solder MaskNone
Top SilkscreenNone
Bottom SilkscreenNone
Electrical Testing100% tested to IPC-Class-2 standards

 
 
 
3. PCB Stackup

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 2Copper (1oz)35 μm
Bonding LayerPrepreg 1060 x 10.05mm
Copper Layer 3Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 4Copper (1oz)35 μm

 
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 1
 
4. Key Features of Rogers RO3010
 

  • Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, enabling efficient circuit miniaturization.
  • Dissipation Factor (Df): 0.0022 at 10 GHz, ensuring minimal signal loss.
  • Thermal Stability:
  • Decomposition Temperature (Td) > 500°C for reliability in high-heat environments.
  • Thermal Conductivity: 0.95 W/mK for effective heat dissipation.
  • Dimensional Stability:
  • Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z), ensuring compatibility with copper.
  • Moisture Absorption: 0.05%, making it reliable in humid conditions.

 
 
 
5. Applications of the 4-Layer PCB

  • Automotive Radar Systems
  • Global Positioning Satellite (GPS) Antennas
  • Cellular Telecommunications Systems
  • Patch Antennas for Wireless Communications
  • Satellite Communications
  • Remote Meter Readers
  • Power Backplanes

 
 
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
 
 
 
What Sets Us Apart?

  1. High Standards: All PCBs are produced to IPC-Class-2 standards and undergo rigorous testing to ensure quality.
  2. Global Availability: We deliver worldwide, ensuring timely support for your projects.
  3. Customer Support: We work closely with clients to provide customized solutions for their specific needs.

 
 
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!
 

Mappa del sito |  Politica sulla privacy | La Cina va bene. Qualità Bicheng PCB appena spediti Fornitore. 2016-2025 Shenzhen Bicheng Electronics Technology Co., Ltd Tutti. Tutti i diritti riservati.