logo
prodotti
Dettagli dei prodotti
Casa. > prodotti >
CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers

CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers

MOQ: 1pcs
prezzo: 2.99USD/pcs
imballaggio standard: Imballaggio
Periodo di consegna: 2-10 giorni lavorativi
metodo di pagamento: T/T, PayPal
Capacità di approvvigionamento: 50000pcs
Informazione dettagliata
Luogo di origine
Cina
Marca
Rogers
Certificazione
ISO9001
Numero di modello
Cuclad 233
Quantità di ordine minimo:
1pcs
Prezzo:
2.99USD/pcs
Imballaggi particolari:
Imballaggio
Tempi di consegna:
2-10 giorni lavorativi
Termini di pagamento:
T/T, PayPal
Capacità di alimentazione:
50000pcs
Descrizione del prodotto

CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 

Overview of CuClad 233 2-Layer PCB

The CuClad 233 PCB is a high-performance 2-layer rigid PCB built with Rogers CuClad 233 laminates, designed to provide superior electrical performance and mechanical stability. Featuring a 20mil core and a finished thickness of 0.6mm, this PCB is engineered for microwave and RF applications, offering a low dielectric constant (Dk) of 2.33 and a dissipation factor of 0.0013 at 10GHz.

 

With its balanced fiberglass/PTFE composite construction, the CuClad 233 PCB ensures dimensional stability, low insertion loss, and repeatable performance across wide frequency ranges. Its immersion gold finish enhances solderability and corrosion resistance, making it an ideal solution for radars, microwave components, and electronic countermeasures worldwide.

 

CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers 0

 

PCB Construction Details

Parameter Specification
Base Material Rogers CuClad 233
Layer Count 2 layers
Board Dimensions 108mm x 59mm
Minimum Trace/Space 6/8 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

 

PCB Stackup

The CuClad 233 PCB stackup is designed for optimal electrical performance while maintaining structural stability:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35μm
Dielectric Layer Rogers CuClad 233 Core 0.508mm (20mil)
Copper Layer 2 Copper (1oz) 35μm

 

 

 

Introduction to CuClad 233 Material

Rogers CuClad 233 laminates are constructed using cross-plied woven fiberglass and PTFE composites, providing balanced electrical and mechanical properties. With a low dielectric constant (Dk) of 2.33 and dissipation factor of 0.0013, these laminates ensure low insertion loss and excellent dielectric uniformity. The cross-plied construction enhances dimensional stability, while the high PTFE-to-glass ratio supports consistent performance over a broad frequency range.

 

Key Features of CuClad 233

  • Dielectric Constant (Dk): 2.33 at 10GHz/1MHz.
  • Dissipation Factor: 0.0013 at 10GHz for minimal signal loss.
  • Moisture Resistance: Low absorption rate of 0.02%.
  • Peel Strength: High peel strength of 14 lbs/in for reliable bonding.
  • Low Outgassing: Total mass loss (TML) and collected volatile condensable material (CVCM) are just 0.01%, ensuring suitability for space and vacuum applications.
  • Dimensional Stability: Cross-plied construction provides unmatched stability compared to non-woven fiberglass laminates.

 

Benefits of CuClad 233

  • Stable Electrical Properties: Consistent Dk and low loss across a wide frequency range.
  • Reduced Circuit Losses: Supports wider line widths for lower insertion loss.
  • Large PCB Support: Ideal for large-format designs like antennas.
  • CTE Match with Aluminum: In-plane CTE matches aluminum, making it suitable for aircraft skins and structures.

 

 

Applications

Radars: Advanced radar systems for aerospace and defense.

Electronic Countermeasures (ECM): Reliable for military-grade signal disruption systems.

Microwave Components: Low noise amplifiers (LNAs), filters, couplers, and more.

 

 

Conclusion

The CuClad 233 2-layer PCB is a high-performance solution designed for RF and microwave systems, offering low dielectric constant, minimal signal loss, and mechanical stability. With its 20mil Rogers CuClad 233 core, 1oz copper layers, and immersion gold finish, this PCB ensures reliable performance for applications such as radars, electronic countermeasures, and microwave components.

 

Engineered to meet IPC-Class-2 standards and available worldwide, the CuClad 233 PCB is an excellent choice for engineers seeking a cost-effective, high-frequency PCB solution.

 

Prodotti raccomandati
prodotti
Dettagli dei prodotti
CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers
MOQ: 1pcs
prezzo: 2.99USD/pcs
imballaggio standard: Imballaggio
Periodo di consegna: 2-10 giorni lavorativi
metodo di pagamento: T/T, PayPal
Capacità di approvvigionamento: 50000pcs
Informazione dettagliata
Luogo di origine
Cina
Marca
Rogers
Certificazione
ISO9001
Numero di modello
Cuclad 233
Quantità di ordine minimo:
1pcs
Prezzo:
2.99USD/pcs
Imballaggi particolari:
Imballaggio
Tempi di consegna:
2-10 giorni lavorativi
Termini di pagamento:
T/T, PayPal
Capacità di alimentazione:
50000pcs
Descrizione del prodotto

CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 

Overview of CuClad 233 2-Layer PCB

The CuClad 233 PCB is a high-performance 2-layer rigid PCB built with Rogers CuClad 233 laminates, designed to provide superior electrical performance and mechanical stability. Featuring a 20mil core and a finished thickness of 0.6mm, this PCB is engineered for microwave and RF applications, offering a low dielectric constant (Dk) of 2.33 and a dissipation factor of 0.0013 at 10GHz.

 

With its balanced fiberglass/PTFE composite construction, the CuClad 233 PCB ensures dimensional stability, low insertion loss, and repeatable performance across wide frequency ranges. Its immersion gold finish enhances solderability and corrosion resistance, making it an ideal solution for radars, microwave components, and electronic countermeasures worldwide.

 

CuClad 233 2-Layer PCB built on 20mil(0.6mm) Core laminate with Immersion Gold Finish for LNAs, filters, couplers 0

 

PCB Construction Details

Parameter Specification
Base Material Rogers CuClad 233
Layer Count 2 layers
Board Dimensions 108mm x 59mm
Minimum Trace/Space 6/8 mils
Minimum Hole Size 0.3mm
Blind Vias None
Finished Thickness 0.6mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested before shipment

 

 

 

PCB Stackup

The CuClad 233 PCB stackup is designed for optimal electrical performance while maintaining structural stability:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35μm
Dielectric Layer Rogers CuClad 233 Core 0.508mm (20mil)
Copper Layer 2 Copper (1oz) 35μm

 

 

 

Introduction to CuClad 233 Material

Rogers CuClad 233 laminates are constructed using cross-plied woven fiberglass and PTFE composites, providing balanced electrical and mechanical properties. With a low dielectric constant (Dk) of 2.33 and dissipation factor of 0.0013, these laminates ensure low insertion loss and excellent dielectric uniformity. The cross-plied construction enhances dimensional stability, while the high PTFE-to-glass ratio supports consistent performance over a broad frequency range.

 

Key Features of CuClad 233

  • Dielectric Constant (Dk): 2.33 at 10GHz/1MHz.
  • Dissipation Factor: 0.0013 at 10GHz for minimal signal loss.
  • Moisture Resistance: Low absorption rate of 0.02%.
  • Peel Strength: High peel strength of 14 lbs/in for reliable bonding.
  • Low Outgassing: Total mass loss (TML) and collected volatile condensable material (CVCM) are just 0.01%, ensuring suitability for space and vacuum applications.
  • Dimensional Stability: Cross-plied construction provides unmatched stability compared to non-woven fiberglass laminates.

 

Benefits of CuClad 233

  • Stable Electrical Properties: Consistent Dk and low loss across a wide frequency range.
  • Reduced Circuit Losses: Supports wider line widths for lower insertion loss.
  • Large PCB Support: Ideal for large-format designs like antennas.
  • CTE Match with Aluminum: In-plane CTE matches aluminum, making it suitable for aircraft skins and structures.

 

 

Applications

Radars: Advanced radar systems for aerospace and defense.

Electronic Countermeasures (ECM): Reliable for military-grade signal disruption systems.

Microwave Components: Low noise amplifiers (LNAs), filters, couplers, and more.

 

 

Conclusion

The CuClad 233 2-layer PCB is a high-performance solution designed for RF and microwave systems, offering low dielectric constant, minimal signal loss, and mechanical stability. With its 20mil Rogers CuClad 233 core, 1oz copper layers, and immersion gold finish, this PCB ensures reliable performance for applications such as radars, electronic countermeasures, and microwave components.

 

Engineered to meet IPC-Class-2 standards and available worldwide, the CuClad 233 PCB is an excellent choice for engineers seeking a cost-effective, high-frequency PCB solution.

 

Mappa del sito |  Politica sulla privacy | La Cina va bene. Qualità Bicheng PCB appena spediti Fornitore. 2016-2025 Shenzhen Bicheng Electronics Technology Co., Ltd Tutti. Tutti i diritti riservati.