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RO4003C 8-Layer Multilayer PCB 4 core boards 1.524mm RO4003C+1.524mm RO4003C + 0.762mm RO4003C + 0.762mm RO4003C RO4450F

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L'impedenza ha controllato il PWB

RO4003C 8-Layer Multilayer PCB 4 core boards 1.524mm RO4003C+1.524mm RO4003C + 0.762mm RO4003C + 0.762mm RO4003C RO4450F

MOQ:	1 pz
prezzo:	0.99-99USD/PCS
imballaggio standard:	Imballaggio
Periodo di consegna:	2-10 giorni lavorativi
metodo di pagamento:	T/T, Paypal
Capacità di approvvigionamento:	50000 pezzi

Informazione dettagliata

Descrizione del prodotto

Informazione dettagliata

Luogo di origine

Marca

Rogers

Certificazione

ISO9001

Numero di modello

RO4003C

Quantità di ordine minimo:

Prezzo:

0.99-99USD/PCS

Imballaggi particolari:

Imballaggio

Tempi di consegna:

2-10 giorni lavorativi

Termini di pagamento:

T/T, Paypal

Capacità di alimentazione:

50000 pezzi

Descrizione del prodotto

8-Layer Multilayer PCB with RO4003C

This custom-engineered printed circuit board is designed for demanding high-frequency and high-speed digital applications. Featuring a robust multilayer stack-up of Rogers RO4003C laminates and RO4450F bondply, this board delivers exceptional signal integrity, thermal management, and mechanical stability.

Key Specifications

Parameter	Details
Layer Count	8 Layers
Material	RO4003C (Rogers Laminate) + RO4450F Prepreg
Core Build	4 Core Boards: 1.524mm + 1.524mm + 0.762mm + 0.762mm
Lamination Thickness	5.05 mm
Copper Weight	Outer: 1 oz / Inner: 0.5 oz
Surface Finish	Immersion Gold (ENIG)
Solder Mask	Top: Green (No Legend) / Bottom: Green with White Lettering
Dimensions	91 mm x 77 mm

Material Advantage: RO4003C

The board utilizes RO4003C, a hydrocarbon ceramic laminate from Rogers Corporation. Unlike standard FR4, RO4003C offers:

Stable Dielectric Constant (Dk): 3.38 ± 0.05 for precise impedance control

Low Dissipation Factor (Df): 0.0027 @ 10 GHz minimizes signal loss

Excellent Thermal Conductivity: 0.71 W/m/K for efficient heat dissipation

Consistent Performance: Reliable across frequency and temperature variations

The RO4450F bondply ensures robust multilayer bonding and thermal stability throughout the stack.

Multilayer Board Fabrication Guide for RO4003C

Inner Layer Preparation

Surface Preparation: Chemical cleaning and micro-etching is recommended for thinner cores, while mechanical scrubbing is suitable for thicker laminates.

Oxide Treatment: RO4003C cores can be processed through standard copper oxide or alternative treatments to prepare for multilayer bonding.

Drilling Guidelines

Parameter	Recommended Range
Surface Speed	300-500 SFM (90-150 m/min)
Chip Load	0.002"-0.004"/rev (0.05-0.10 mm)
Tool Type	Standard carbide drills
Tool Life	2,000-3,000 hits

Note: Drilling speeds above 500 SFM should be avoided. Expected hole wall roughness: 8-25 µm.

Plated Through-Hole (PTH) Processing

Desmear: Typically not required for double-sided boards. For multilayers, alkaline permanganate or plasma processes may be used.

Etchback: Not recommended as it may loosen filler particles.

Metallization: Compatible with standard electroless copper and direct deposition processes.

Routing Guidelines

Tool Diameter	Spindle Speed	Feed Rate
1/32"	40k RPM	50 IPM
1/16"	25k RPM	31 IPM
1/8"	15k RPM	25 IPM

Use carbide multi-fluted spiral routers

Remove copper from routing path to prevent burring

Maximum stack height: 70% of flute length

Applications

This 8-layer RO4003C PCB is ideal for:

Telecommunications: 5G base stations, backhaul equipment

RF/Microwave Circuits: Power amplifiers, filters, low-noise amplifiers

High-Speed Digital: SerDes channels, high-layer count backplanes

Aerospace & Defense: Radar systems, high-reliability communications

PWB ad alta velocità,

progettazione di circuito ad alta frequenza,

bluetooth circuit board

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RO4003C 8-Layer Multilayer PCB 4 core boards 1.524mm RO4003C+1.524mm RO4003C + 0.762mm RO4003C + 0.762mm RO4003C RO4450F

MOQ:	1 pz
prezzo:	0.99-99USD/PCS
imballaggio standard:	Imballaggio
Periodo di consegna:	2-10 giorni lavorativi
metodo di pagamento:	T/T, Paypal
Capacità di approvvigionamento:	50000 pezzi

Informazione dettagliata

Descrizione del prodotto

Informazione dettagliata

Luogo di origine

Cina

Marca

Rogers

Certificazione

ISO9001

Numero di modello

RO4003C

Quantità di ordine minimo:

1 pz

Prezzo:

0.99-99USD/PCS

Imballaggi particolari:

Imballaggio

Tempi di consegna:

2-10 giorni lavorativi

Termini di pagamento:

T/T, Paypal

Capacità di alimentazione:

50000 pezzi

Descrizione del prodotto

8-Layer Multilayer PCB with RO4003C

Key Specifications

Parameter	Details
Layer Count	8 Layers
Material	RO4003C (Rogers Laminate) + RO4450F Prepreg
Core Build	4 Core Boards: 1.524mm + 1.524mm + 0.762mm + 0.762mm
Lamination Thickness	5.05 mm
Copper Weight	Outer: 1 oz / Inner: 0.5 oz
Surface Finish	Immersion Gold (ENIG)
Solder Mask	Top: Green (No Legend) / Bottom: Green with White Lettering
Dimensions	91 mm x 77 mm

Material Advantage: RO4003C

The board utilizes RO4003C, a hydrocarbon ceramic laminate from Rogers Corporation. Unlike standard FR4, RO4003C offers:

Stable Dielectric Constant (Dk): 3.38 ± 0.05 for precise impedance control

Low Dissipation Factor (Df): 0.0027 @ 10 GHz minimizes signal loss

Excellent Thermal Conductivity: 0.71 W/m/K for efficient heat dissipation

Consistent Performance: Reliable across frequency and temperature variations

The RO4450F bondply ensures robust multilayer bonding and thermal stability throughout the stack.

Multilayer Board Fabrication Guide for RO4003C

Inner Layer Preparation

Surface Preparation: Chemical cleaning and micro-etching is recommended for thinner cores, while mechanical scrubbing is suitable for thicker laminates.

Oxide Treatment: RO4003C cores can be processed through standard copper oxide or alternative treatments to prepare for multilayer bonding.

Drilling Guidelines

Parameter	Recommended Range
Surface Speed	300-500 SFM (90-150 m/min)
Chip Load	0.002"-0.004"/rev (0.05-0.10 mm)
Tool Type	Standard carbide drills
Tool Life	2,000-3,000 hits

Note: Drilling speeds above 500 SFM should be avoided. Expected hole wall roughness: 8-25 µm.

Plated Through-Hole (PTH) Processing

Desmear: Typically not required for double-sided boards. For multilayers, alkaline permanganate or plasma processes may be used.

Etchback: Not recommended as it may loosen filler particles.

Metallization: Compatible with standard electroless copper and direct deposition processes.

Routing Guidelines

Tool Diameter	Spindle Speed	Feed Rate
1/32"	40k RPM	50 IPM
1/16"	25k RPM	31 IPM
1/8"	15k RPM	25 IPM

Use carbide multi-fluted spiral routers

Remove copper from routing path to prevent burring

Maximum stack height: 70% of flute length

Applications

This 8-layer RO4003C PCB is ideal for:

Telecommunications: 5G base stations, backhaul equipment

RF/Microwave Circuits: Power amplifiers, filters, low-noise amplifiers

High-Speed Digital: SerDes channels, high-layer count backplanes

Aerospace & Defense: Radar systems, high-reliability communications

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