Rogers Corporation's RT/duroid 5880 CCL laminate low DK2.2 glass microfiber reinforced PTFE composite for RF Microwave PCB

RT/duroid® 5880: The Gold Standard for High-Frequency Laminates

When your RF and microwave designs demand the lowest possible signal loss and the most stable electrical properties available, look no further than Rogers Corporation's RT/duroid® 5880. As a glass microfiber reinforced PTFE composite, RT/duroid 5880 has earned its reputation as the industry benchmark for high-performance circuit materials, delivering exceptional consistency and reliability from DC through Ku-band and beyond.

Unmatched Electrical Performance

At the heart of RT/duroid 5880 is its exceptionally low and stable dielectric constant. With a process Dk of 2.20 ± 0.02 and a design Dk of 2.20, this material offers one of the lowest dielectric constants available in a reinforced laminate. This ultra-low Dk enables larger trace geometries for a given impedance, reducing conductor losses and simplifying fabrication.

The dissipation factor (Df) of RT/duroid 5880 is equally impressive: 0.0009 at 10 GHz and as low as 0.0004 at 1 MHz. This extraordinarily low loss tangent minimizes insertion loss, making it the material of choice for sensitive applications such as:

• Satellite communications (satcom) systems requiring minimal signal degradation
• Phased array radar and active electronically scanned arrays (AESA)
• Millimeter-wave automotive radar for advanced driver-assistance systems (ADAS)
• Aerospace and defense applications demanding mission-critical reliability

The randomly oriented glass microfibers in RT/duroid 5880 ensure exceptional dielectric constant uniformity across every panel. This consistency translates directly to repeatable impedance control and predictable filter responses—critical factors when designing tight-tolerance RF circuits.

Superior Thermal and Mechanical Stability

RT/duroid 5880 exhibits a thermal coefficient of dielectric constant of -125 ppm/°C, meaning its Dk changes predictably and minimally with temperature fluctuations. This stability ensures that circuit performance remains consistent across operating environments.

The material's thermal conductivity of 0.20 W/m/K and a thermal decomposition temperature (Td) of 500°C demonstrate its ability to withstand demanding thermal conditions. For applications involving plated through-holes, the coefficient of thermal expansion (CTE) values of 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis) should be carefully considered in multi-layer board designs.

Fabrication Flexibility

Despite its exceptional electrical properties, RT/duroid 5880 is designed for practical manufacturing. The laminate can be easily cut, sheared, and machined to shape using standard techniques. It is resistant to all solvents and reagents—both hot and cold—commonly used in etching printed circuits and plating edges and holes.

The material is available with multiple cladding options to suit your specific needs:

• Electrodeposited copper foil (½ oz. to 2 oz.) for general applications
• Reverse treated electrodeposited copper for improved adhesion
• Rolled copper foil for the most demanding electrical applications requiring ultra-smooth copper surfaces

Standard Configurations

RT/duroid 5880 is available in standard thicknesses ranging from 0.005" to 0.062", with additional thicknesses available from 0.0035" to 0.375" upon request. Standard panel sizes include 18" x 12" and 18" x 24", and the material carries a UL 94V-0 flammability rating and is lead-free process compatible.

Why Choose RT/duroid 5880?

For engineers who cannot compromise on signal integrity, RT/duroid 5880 delivers the lowest loss, most stable dielectric properties in a reinforced PTFE platform. Its combination of ultra-low Dk and Df, exceptional uniformity, and fabrication-friendly characteristics makes it the trusted choice for the world's most demanding high-frequency applications.

Contact us today to discuss how RT/duroid 5880 can elevate the performance of your next RF design.