Looking for a High-Frequency PCB with FR4-Like Processability? Explore the WL-CT300 Hydrocarbon Ceramic Laminate (Dk 3.00, TG >280°C, -55°C to +260°C)

Precision RF PCB Solution Based on WL-CT300: High-Frequency Performance with FR4-Like Processability

For designers working on RF, microwave, and aerospace applications, material selection is a constant trade-off between electrical performance and manufacturability. Traditional PTFE-based laminates offer low loss but introduce challenges in dimensional stability, multilayer processing, and consistency. The WL-CT300 from Taizhou Wangling Insulating Materials Factory closes this gap—combining thermosetting hydrocarbon-ceramic resin with woven fiberglass to deliver exceptional high-frequency characteristics alongside FR4-compatible PCB fabrication processes.

We are now offering a custom 2-layer rigid PCB built on WL-CT300, engineered for compact, high-reliability RF and high-frequency circuits.

1. WL-CT300 Laminate: Key Properties

The WL-CT300 laminate is composed of hydrocarbon resin, ceramic, and fiberglass cloth, forming a thermosetting resin system. Unlike PTFE-based materials, this laminate can be processed using standard FR4 fabrication techniques, which ensures better circuit stability and consistency.

Key properties are summarized in the table below.

Note on RTF Copper: When RTF (reverse treated) copper foil is specified, an additional 0.018 mm (0.7 mil) is added to the dielectric thickness due to the adhesive backing. RTF copper offers excellent PIM performance, reduced conductor loss, and lower insertion loss.

General Note: All data are provided as typical values. Measurements are performed using GB/T 12636-1990 or IPC-TM650 2.5.5.5 (stripline method) for Dk/Df. Design values are measured using the 50Ω microstrip line method. Other properties are tested per IPC-TM-650 or GBT4722-2017. The information is intended for material selection reference only and should not be construed as a warranty. Customers are advised to verify suitability for each intended application.

2. Ordering Requirements for WL-CT300 Laminate

To ensure accurate fulfillment, the following information is required to be specified when an order is placed:

Standard Dielectric Thicknesses and Tolerances (WL-CT300):

Aluminum-Backed Version (WL-CTxxx-AL):

3. Custom PCB Specifications (Based on WL-CT300)

The following 2-layer rigid PCB has been designed and manufactured using WL-CT300 as the core material.

Construction Details

4. Key Advantages of WL-CT300 vs. PTFE-Based Laminates

5. Frequency and Temperature Stability Characteristics

The WL-CT300 material exhibits excellent frequency and temperature stability, as summarized below:

6. Applications – Where This PCB Excels

Based on Wangling’s typical applications for WL-CT300, this 0.25 mm thin, 2-layer PCB is well-suited for:

Small form-factor satellite communication modules (low outgassing, radiation tolerant)

Phased-array antenna feed boards (tight εr tolerance ±0.05, stable phase over temp)

Power amplifiers (high Tg, thermal conductivity >0.4 W/m·K)

Automotive radar sensors (compact size, consistent Df up to 24 GHz)

Avionics and space-cabin equipment (vacuum stability, mechanical robustness)

The absence of solder mask also supports high-voltage or corona-sensitive designs where bare dielectric clearance is preferred.

7. Why This WL-CT300-Based PCB Solution Should Be Considered

Superior processability is offered: FR4-like fabrication is enabled, reducing manufacturing complexity and cost compared to PTFE materials.

Excellent electrical performance is achieved: Low loss (Df 0.0025–0.0036) and a stable Dk (3.00 ±0.05) are provided across 0.5–25 GHz.

High thermal reliability is ensured: Continuous operation from -55°C to +260°C is supported, with Tg >280°C and Td of 412°C.

Excellent dimensional stability is delivered: CTE in X/Y (15/14 ppm/°C) is matched to copper, while low Z-axis CTE (31 ppm/°C) ensures plated through-hole reliability.

High thermal conductivity is provided: 0.41 W/(m·K) is offered, which is superior to comparable thermoplastic materials for high-power applications.

Space-grade reliability is demonstrated: Radiation resistance and low outgassing properties are exhibited, meeting aerospace requirements.

High-volume, cost-effective production is available: The material is designed for commercial, high-volume applications with excellent value.

PIM performance is optimized: When paired with RTF copper, PIM values of ≤-158 dBc are achieved, reducing passive intermodulation.

Conclusion

Wangling's WL-CT300 hydrocarbon ceramic laminate, combined with the custom 2-layer PCB design described above, can be regarded as a reliable, low-loss, and highly manufacturable solution for demanding microwave, automotive radar, aerospace, and communication systems. The ability to process this material using standard FR4 techniques provides a significant advantage over PTFE-based alternatives, enabling faster turnaround times, lower costs, and more consistent results.