| MOQ: | 1 pezzo |
| prezzo: | 0.99-99USD/PCS |
| imballaggio standard: | Imballaggio |
| Periodo di consegna: | 8 giorni lavorativi |
| metodo di pagamento: | T/T, Paypal |
| Capacità di approvvigionamento: | 50000 pezzi |
Introduction
In high-frequency microwave circuit design, achieving circuit miniaturization while maintaining excellent electrical performance is a constant challenge. One of the most effective strategies for reducing circuit size is to use a substrate material with a high dielectric constant (Dk). Higher Dk materials allow for shorter wavelengths within the substrate, enabling smaller passive components such as couplers, filters, and resonators.
![]()
Taconic CER-10 is a premium organic-ceramic laminate from the ORCER® product family, specifically engineered to address this need. With a nominal dielectric constant of 10.0 and a low dissipation factor of 0.0035 at 10 GHz, CER-10 enables significant circuit miniaturization while maintaining low signal loss. This makes it an ideal choice for compact microwave assemblies, power amplifiers, and waveguide-based passive components.
This article provides a comprehensive overview of CER-10 laminate properties, a detailed 2-layer PCB design example, and key sourcing information for engineers and procurement professionals.
What Is Taconic CER-10 Laminate?
Taconic CER-10 is an organic-ceramic laminate that combines Taconic's advanced ceramic fill technology with its deep expertise in coated PTFE fiberglass. The material is based on a woven glass reinforcement, which ensures excellent dimensional stability and enhanced flexural strength.
CER-10 exhibits exceptional interlaminar bond strength and solder resistance, ensuring reliable performance in demanding manufacturing and operating environments. Its proprietary composition results in very low moisture absorption (0.02%) and uniform electrical properties across the material.
The material's low Z-axis coefficient of thermal expansion (CTE of 46 ppm/°C) allows for reliable plated-through-hole (PTH) integrity even in extreme thermal environments, making it suitable for applications subject to temperature cycling and thermal shock.
Key Differentiator: High Dielectric Constant for Circuit Miniaturization
With a Dk of 10.0, CER-10 is significantly higher than standard RF materials like RO4350B (Dk ~3.48) or PTFE-based laminates (Dk ~2.2–2.6). This high Dk enables:
Up to 50–60% reduction in component size for quarter-wave resonators, couplers, and filters
More compact PCB layouts for space-constrained applications
Lower profile designs without compromising electrical performance
Properties of CER-10 Laminate
| Property | Test Method | Value (US) | Value (Metric) |
| Electrical Properties | |||
| Dielectric Constant (Nominal) | IPC-TM-650 2.5.5.6 | 10 | 10 |
| Dissipation Factor @ 10 GHz | IPC-TM-650 2.5.5.5.1 | 0.0035 | 0.0035 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | 44 kV | 44 kV |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | 2.1 × 10⁸ Mohm/cm | 2.1 × 10⁸ Mohm/cm |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | 1.1 × 10⁹ Mohm | 1.1 × 10⁹ Mohm |
| Arc Resistance | IPC-TM-650 2.5.1 | >180 Seconds | >180 Seconds |
| Thermal Properties | |||
| CTE (X-Axis) | ASTM D 3386 (TMA) | 13 ppm/°C | 13 ppm/°C |
| CTE (Y-Axis) | ASTM D 3386 (TMA) | 15 ppm/°C | 15 ppm/°C |
| CTE (Z-Axis) | ASTM D 3386 (TMA) | 46 ppm/°C | 46 ppm/°C |
| Thermal Conductivity | ASTM F 433 | 0.63 W/m/K | 0.63 W/m/K |
| Mechanical Properties | |||
| Flexural Strength (MD) | ASTM D 790 | 16,500 psi | 114 N/mm² |
| Flexural Strength (CD) | ASTM D 790 | 15,500 psi | 107 N/mm² |
| Tensile Strength (MD) | ASTM D 638 | 7,700 psi | 53 N/mm² |
| Tensile Strength (CD) | ASTM D 3039 | 6,700 psi | 46 N/mm² |
| Peel Strength (1 oz. ED) | IPC-TM-650 2.4.8 | 9 lbs/linear inch | 1.61 N/mm |
| Dimensional Stability (MD) | IPC-TM-650 2.4.39 | -0.0002 in/in | -0.0002 mm/mm |
| Dimensional Stability (CD) | IPC-TM-650 2.4.39 | -0.0003 in/in | -0.0003 mm/mm |
| Physical & Environmental Properties | |||
| Moisture Absorption | IPC-TM-650 2.6.2.1 | 0.02% | 0.02% |
| Density (Specific Gravity) | – | 3.05 g/cm³ | 3.05 g/cm³ |
| Outgassing – TML | ASTM E 595* | 0.02% | 0.02% |
| Outgassing – CVCM | ASTM E 595* | 0.01% | 0.01% |
| Outgassing – WVR | ASTM E 595* | 0.01% | 0.01% |
| Flammability Rating | UL 94 | V-0 | V-0 |
Features and Benefits Summary
| Feature | Benefit |
| High Dk of 10.0 | Enables significant circuit miniaturization; reduces size of quarter-wave resonators, couplers, and filters |
| Low Df of 0.0035 @ 10 GHz | Low signal loss for high-frequency microwave applications |
| Exceptional interlaminar bond strength | Reliable multilayer construction; excellent solder resistance |
| Low moisture absorption (0.02%) | Stable electrical properties in humid environments; negligible performance drift |
| Woven glass reinforcement | Enhanced dimensional stability and flexural strength |
| Low Z-axis CTE (46 ppm/°C) | Reliable plated-through-hole (PTH) integrity under thermal cycling |
| V-0 Flammability Rating | UL 94 compliant for safety-critical applications |
| NASA low-outgassing certified | Suitable for aerospace and space applications |
| Standard PTFE processing | Can be sheared, drilled, milled, and plated using standard methods |
Standard Offerings
CER-10 laminates are available in a variety of standard thicknesses, panel sizes, and copper cladding options.
| Designation | Thickness (Inches) | Thickness (mm) | Dk Tolerance |
| CER-10 | 0.0250" | 0.64 mm | 9.50 ± 0.50 |
| CER-10 | 0.0300" | 0.76 mm | 9.70 ± 0.50 |
| CER-10 | 0.0470" | 1.19 mm | 9.80 ± 0.50 |
| CER-10 | 0.0500" | 1.27 mm | 9.80 ± 0.50 |
| CER-10 | 0.0620" | 1.58 mm | 10.0 ± 0.50 |
| CER-10 | 0.0750" | 1.91 mm | 10.0 ± 0.50 |
| CER-10 | 0.1000" | 2.54 mm | 10.0 ± 0.50 |
| CER-10 | 0.1250" | 3.18 mm | 10.2 ± 0.50 |
Note: Other thicknesses may be available upon request.
Standard Panel Sizes & Claddings
| Parameter | Options |
| Standard Panel Size | 18" × 24" (457 mm × 610 mm) |
| Available Panel Sizes | Additional sizes available upon request |
| Standard Claddings | Electrodeposited copper: ½ oz., 1 oz., or 2 oz. (both sides) |
| Part Number Example | CER-10-0500-CV1/CV1 – 18" × 24" (457 mm × 610 mm) |
2-Layer PCB Design Example Using CER-10
To demonstrate the practical application of CER-10, the following is a complete 2-layer rigid PCB design case.
![]()
PCB Design Specifications
| Parameter | Specification |
| Base Material | Taconic CER-10 |
| Layer Count | 2-layer rigid |
| Board Dimensions | 67.00 mm × 55.90 mm per panel |
| Minimum Trace/Space | 5 / 6 mils |
| Minimum Hole Size | 0.4 mm |
| Blind/Buried Vias | None |
| Finished Cu Weight | 1 oz (35 μm) all layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Service Area | Worldwide |
Design Observations
This design features a compact 67 mm × 55.9 mm board with 28 components and only 2 nets. Key observations include:
High via count (25 vias) – Reflects the need for frequent grounding or shielding in a microwave design
No solder mask – A deliberate choice for microwave applications where solder mask could introduce unwanted dielectric effects or parasitic capacitance
No silkscreen – Maintains a clean RF surface and avoids contamination
Immersion Silver finish – Provides excellent conductivity and flatness for microwave signal integrity; preferred over ENIG for certain RF applications
IPC-Class-2 compliance – Ensures reliability for commercial and industrial applications
CER-10's high Dk (10.0) – Allows for significant miniaturization of passive components on this compact board
Manufacturing Process Highlights
Standard PTFE processing – CER-10 can be sheared, drilled, milled, and plated using standard methods for PTFE/woven fiberglass materials
No specialized via preparation – Unlike some PTFE materials, CER-10 can be processed with conventional techniques
Fine-pitch capability – 5/6 mil trace/spacing supports dense microwave circuit layouts
Typical Applications
CER-10's unique combination of high Dk, low loss, and excellent mechanical properties makes it ideal for a wide range of microwave applications:
-power amplifiers
-waveguide filters
-directional couplers
-other microwave passive components
Conclusion
Taconic CER-10 laminates offer a unique and compelling value proposition for microwave circuit designers: high dielectric constant (10.0) combined with low loss (0.0035 @ 10 GHz) and excellent mechanical properties. This combination enables significant circuit miniaturization—a critical advantage in space-constrained applications such as compact power amplifiers, waveguide filters, and directional couplers.
Key advantages include:
Circuit miniaturization – Up to 60% size reduction for passive components
Low loss – Df of 0.0035 at 10 GHz maintains signal integrity
Excellent dimensional stability – Woven glass reinforcement with CTE of 13/15 ppm/°C (X/Y)
Reliable PTHs – Low Z-axis CTE of 46 ppm/°C ensures reliability in thermal environments
Low moisture absorption (0.02%) – Stable electrical performance in humid conditions
NASA low-outgassing certified – Suitable for aerospace and space applications
V-0 flammability – UL 94 compliant for safety-critical systems
Standard processing – Can be sheared, drilled, milled, and plated using standard PTFE methods
Whether used in power amplifiers, waveguide filters, or other microwave passive components, CER-10 provides a reliable, high-performance solution for demanding high-frequency applications.
| MOQ: | 1 pezzo |
| prezzo: | 0.99-99USD/PCS |
| imballaggio standard: | Imballaggio |
| Periodo di consegna: | 8 giorni lavorativi |
| metodo di pagamento: | T/T, Paypal |
| Capacità di approvvigionamento: | 50000 pezzi |
Introduction
In high-frequency microwave circuit design, achieving circuit miniaturization while maintaining excellent electrical performance is a constant challenge. One of the most effective strategies for reducing circuit size is to use a substrate material with a high dielectric constant (Dk). Higher Dk materials allow for shorter wavelengths within the substrate, enabling smaller passive components such as couplers, filters, and resonators.
![]()
Taconic CER-10 is a premium organic-ceramic laminate from the ORCER® product family, specifically engineered to address this need. With a nominal dielectric constant of 10.0 and a low dissipation factor of 0.0035 at 10 GHz, CER-10 enables significant circuit miniaturization while maintaining low signal loss. This makes it an ideal choice for compact microwave assemblies, power amplifiers, and waveguide-based passive components.
This article provides a comprehensive overview of CER-10 laminate properties, a detailed 2-layer PCB design example, and key sourcing information for engineers and procurement professionals.
What Is Taconic CER-10 Laminate?
Taconic CER-10 is an organic-ceramic laminate that combines Taconic's advanced ceramic fill technology with its deep expertise in coated PTFE fiberglass. The material is based on a woven glass reinforcement, which ensures excellent dimensional stability and enhanced flexural strength.
CER-10 exhibits exceptional interlaminar bond strength and solder resistance, ensuring reliable performance in demanding manufacturing and operating environments. Its proprietary composition results in very low moisture absorption (0.02%) and uniform electrical properties across the material.
The material's low Z-axis coefficient of thermal expansion (CTE of 46 ppm/°C) allows for reliable plated-through-hole (PTH) integrity even in extreme thermal environments, making it suitable for applications subject to temperature cycling and thermal shock.
Key Differentiator: High Dielectric Constant for Circuit Miniaturization
With a Dk of 10.0, CER-10 is significantly higher than standard RF materials like RO4350B (Dk ~3.48) or PTFE-based laminates (Dk ~2.2–2.6). This high Dk enables:
Up to 50–60% reduction in component size for quarter-wave resonators, couplers, and filters
More compact PCB layouts for space-constrained applications
Lower profile designs without compromising electrical performance
Properties of CER-10 Laminate
| Property | Test Method | Value (US) | Value (Metric) |
| Electrical Properties | |||
| Dielectric Constant (Nominal) | IPC-TM-650 2.5.5.6 | 10 | 10 |
| Dissipation Factor @ 10 GHz | IPC-TM-650 2.5.5.5.1 | 0.0035 | 0.0035 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | 44 kV | 44 kV |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | 2.1 × 10⁸ Mohm/cm | 2.1 × 10⁸ Mohm/cm |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | 1.1 × 10⁹ Mohm | 1.1 × 10⁹ Mohm |
| Arc Resistance | IPC-TM-650 2.5.1 | >180 Seconds | >180 Seconds |
| Thermal Properties | |||
| CTE (X-Axis) | ASTM D 3386 (TMA) | 13 ppm/°C | 13 ppm/°C |
| CTE (Y-Axis) | ASTM D 3386 (TMA) | 15 ppm/°C | 15 ppm/°C |
| CTE (Z-Axis) | ASTM D 3386 (TMA) | 46 ppm/°C | 46 ppm/°C |
| Thermal Conductivity | ASTM F 433 | 0.63 W/m/K | 0.63 W/m/K |
| Mechanical Properties | |||
| Flexural Strength (MD) | ASTM D 790 | 16,500 psi | 114 N/mm² |
| Flexural Strength (CD) | ASTM D 790 | 15,500 psi | 107 N/mm² |
| Tensile Strength (MD) | ASTM D 638 | 7,700 psi | 53 N/mm² |
| Tensile Strength (CD) | ASTM D 3039 | 6,700 psi | 46 N/mm² |
| Peel Strength (1 oz. ED) | IPC-TM-650 2.4.8 | 9 lbs/linear inch | 1.61 N/mm |
| Dimensional Stability (MD) | IPC-TM-650 2.4.39 | -0.0002 in/in | -0.0002 mm/mm |
| Dimensional Stability (CD) | IPC-TM-650 2.4.39 | -0.0003 in/in | -0.0003 mm/mm |
| Physical & Environmental Properties | |||
| Moisture Absorption | IPC-TM-650 2.6.2.1 | 0.02% | 0.02% |
| Density (Specific Gravity) | – | 3.05 g/cm³ | 3.05 g/cm³ |
| Outgassing – TML | ASTM E 595* | 0.02% | 0.02% |
| Outgassing – CVCM | ASTM E 595* | 0.01% | 0.01% |
| Outgassing – WVR | ASTM E 595* | 0.01% | 0.01% |
| Flammability Rating | UL 94 | V-0 | V-0 |
Features and Benefits Summary
| Feature | Benefit |
| High Dk of 10.0 | Enables significant circuit miniaturization; reduces size of quarter-wave resonators, couplers, and filters |
| Low Df of 0.0035 @ 10 GHz | Low signal loss for high-frequency microwave applications |
| Exceptional interlaminar bond strength | Reliable multilayer construction; excellent solder resistance |
| Low moisture absorption (0.02%) | Stable electrical properties in humid environments; negligible performance drift |
| Woven glass reinforcement | Enhanced dimensional stability and flexural strength |
| Low Z-axis CTE (46 ppm/°C) | Reliable plated-through-hole (PTH) integrity under thermal cycling |
| V-0 Flammability Rating | UL 94 compliant for safety-critical applications |
| NASA low-outgassing certified | Suitable for aerospace and space applications |
| Standard PTFE processing | Can be sheared, drilled, milled, and plated using standard methods |
Standard Offerings
CER-10 laminates are available in a variety of standard thicknesses, panel sizes, and copper cladding options.
| Designation | Thickness (Inches) | Thickness (mm) | Dk Tolerance |
| CER-10 | 0.0250" | 0.64 mm | 9.50 ± 0.50 |
| CER-10 | 0.0300" | 0.76 mm | 9.70 ± 0.50 |
| CER-10 | 0.0470" | 1.19 mm | 9.80 ± 0.50 |
| CER-10 | 0.0500" | 1.27 mm | 9.80 ± 0.50 |
| CER-10 | 0.0620" | 1.58 mm | 10.0 ± 0.50 |
| CER-10 | 0.0750" | 1.91 mm | 10.0 ± 0.50 |
| CER-10 | 0.1000" | 2.54 mm | 10.0 ± 0.50 |
| CER-10 | 0.1250" | 3.18 mm | 10.2 ± 0.50 |
Note: Other thicknesses may be available upon request.
Standard Panel Sizes & Claddings
| Parameter | Options |
| Standard Panel Size | 18" × 24" (457 mm × 610 mm) |
| Available Panel Sizes | Additional sizes available upon request |
| Standard Claddings | Electrodeposited copper: ½ oz., 1 oz., or 2 oz. (both sides) |
| Part Number Example | CER-10-0500-CV1/CV1 – 18" × 24" (457 mm × 610 mm) |
2-Layer PCB Design Example Using CER-10
To demonstrate the practical application of CER-10, the following is a complete 2-layer rigid PCB design case.
![]()
PCB Design Specifications
| Parameter | Specification |
| Base Material | Taconic CER-10 |
| Layer Count | 2-layer rigid |
| Board Dimensions | 67.00 mm × 55.90 mm per panel |
| Minimum Trace/Space | 5 / 6 mils |
| Minimum Hole Size | 0.4 mm |
| Blind/Buried Vias | None |
| Finished Cu Weight | 1 oz (35 μm) all layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Accepted Standard | IPC-Class-2 |
| Service Area | Worldwide |
Design Observations
This design features a compact 67 mm × 55.9 mm board with 28 components and only 2 nets. Key observations include:
High via count (25 vias) – Reflects the need for frequent grounding or shielding in a microwave design
No solder mask – A deliberate choice for microwave applications where solder mask could introduce unwanted dielectric effects or parasitic capacitance
No silkscreen – Maintains a clean RF surface and avoids contamination
Immersion Silver finish – Provides excellent conductivity and flatness for microwave signal integrity; preferred over ENIG for certain RF applications
IPC-Class-2 compliance – Ensures reliability for commercial and industrial applications
CER-10's high Dk (10.0) – Allows for significant miniaturization of passive components on this compact board
Manufacturing Process Highlights
Standard PTFE processing – CER-10 can be sheared, drilled, milled, and plated using standard methods for PTFE/woven fiberglass materials
No specialized via preparation – Unlike some PTFE materials, CER-10 can be processed with conventional techniques
Fine-pitch capability – 5/6 mil trace/spacing supports dense microwave circuit layouts
Typical Applications
CER-10's unique combination of high Dk, low loss, and excellent mechanical properties makes it ideal for a wide range of microwave applications:
-power amplifiers
-waveguide filters
-directional couplers
-other microwave passive components
Conclusion
Taconic CER-10 laminates offer a unique and compelling value proposition for microwave circuit designers: high dielectric constant (10.0) combined with low loss (0.0035 @ 10 GHz) and excellent mechanical properties. This combination enables significant circuit miniaturization—a critical advantage in space-constrained applications such as compact power amplifiers, waveguide filters, and directional couplers.
Key advantages include:
Circuit miniaturization – Up to 60% size reduction for passive components
Low loss – Df of 0.0035 at 10 GHz maintains signal integrity
Excellent dimensional stability – Woven glass reinforcement with CTE of 13/15 ppm/°C (X/Y)
Reliable PTHs – Low Z-axis CTE of 46 ppm/°C ensures reliability in thermal environments
Low moisture absorption (0.02%) – Stable electrical performance in humid conditions
NASA low-outgassing certified – Suitable for aerospace and space applications
V-0 flammability – UL 94 compliant for safety-critical systems
Standard processing – Can be sheared, drilled, milled, and plated using standard PTFE methods
Whether used in power amplifiers, waveguide filters, or other microwave passive components, CER-10 provides a reliable, high-performance solution for demanding high-frequency applications.