F4BM265 3-Layer PCB with 6.2mm Thickness and Bare Copper Finish by Bicheng Technologies Limited

F4BM265 3-Layer PCB with 6.2mm Thickness and Bare Copper Finish by Bicheng Technologies Limited

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

At Bicheng Technologies Limited, we’re excited to introduce our F4BM265 3-Layer PCB, a cutting-edge solution for microwave, RF, and radar systems. Built with F4BM265 laminates, this PCB delivers low dielectric loss, high stability, and excellent performance for applications requiring precision and reliability.

With a 6.2mm finished thickness, bare copper surface finish, and three-layer construction, this PCB is designed to meet stringent requirements for high-frequency and microwave applications. Let me walk you through its construction, features, and applications to show why it’s the ideal choice for your next project.

1. Overview of the F4BM265 3-Layer PCB

The F4BM265 3-Layer PCB is engineered to handle high-frequency signals with exceptional thermal and electrical performance. Its three-layer stackup provides enhanced insulation resistance, dimensional stability, and low dielectric loss.

The F4BM265 laminates are made from a scientifically formulated mix of PTFE resin, fiberglass cloth, and polytetrafluoroethylene film, delivering improved electrical performance over similar materials. At Bicheng Technologies Limited, we manufacture all our PCBs to IPC-Class-2 standards and ensure that every board undergoes 100% electrical testing for reliability and performance.

PCB Construction Details

Here’s a detailed breakdown of the F4BM265 PCB’s construction:

This robust three-layer construction ensures optimal thermal stability, low insertion loss, and dimensional accuracy for demanding high-frequency applications.

2. Features and Benefits of F4BM265 Material

The F4BM265 laminate is a high-performance PTFE-based material designed for microwave and RF applications. Its unique composition allows for precise control of dielectric constant (Dk), low dissipation factor, and excellent thermal stability, making it an ideal choice for high-frequency circuits.

Key Features of F4BM265:

• Dielectric Constant (Dk): 2.65 ± 0.05 at 10GHz, providing stable and accurate signal propagation.
• Dissipation Factor (Df): 0.0013 at 10GHz and 0.0018 at 20GHz, ensuring minimal signal loss.
• Thermal Stability: TCDK: -100ppm/°C from -55°C to 150°C.
• CTE (Coefficient of Thermal Expansion):
  • X-axis: 14ppm/°C
  • Y-axis: 17ppm/°C
  • Z-axis: 142ppm/°C, ensuring dimensional stability under thermal stress.
• Thermal Conductivity: 0.36W/mK, enabling efficient heat dissipation.
• Moisture Resistance: Low Moisture Absorption: Just 0.08%, ensuring reliability in humid environments.

Key Benefits of F4BM265 Material:

Precision and Stability: The carefully controlled Dk allows for consistent high-frequency performance.

Low Loss: The low dissipation factor reduces transmission line loss, enhancing signal efficiency.

Dimensional Stability: The material’s low CTE ensures mechanical reliability and stable performance in high-temperature environments.

Long-Term Reliability: Improved insulation resistance and reduced temperature drift ensure durability in demanding applications.

3. Applications of the F4BM265 PCB

The F4BM265 3-Layer PCB is designed for industries that demand high reliability, low loss, and precision performance in high-frequency environments.

Key Applications:

Microwave, RF, and Radar Systems: Ideal for applications requiring low insertion loss and stable signal performance.

Phase Shifters and Passive Components: Used in systems requiring precise signal control and low dielectric loss.

Power Dividers, Couplers, and Combiners: Ensures efficient power handling and thermal stability in RF systems.

Feed Networks and Phased Array Antennas: Supports high-frequency antenna systems with dimensional stability.

Satellite Communications and Base Station Antennas: Provides reliable performance in critical communication systems.

These applications demonstrate the versatility and reliability of the F4BM265 PCB in high-frequency and high-stakes environments.

Why Choose Bicheng Technologies Limited?

At Bicheng Technologies Limited, we are committed to delivering innovative PCB solutions that meet the demands of advanced industries. The F4BM265 3-Layer PCB is a testament to our dedication to quality, offering low loss, thermal efficiency, and mechanical reliability.

Every PCB we manufacture is made to IPC-Class-2 standards and undergoes rigorous 100% electrical testing to ensure consistent quality. With worldwide availability, we provide tailored solutions for microwave, RF, and radar systems.

If you have any technical questions or need assistance finding the right PCB for your application, feel free to contact me, Sally, at sales30@bichengpcb.com. I’d be happy to help you with your project.