RO4350B + High Tg FR-4 Hybrid 6-Layer PCB built on 1.6mm Thickness with Immersion silver by Bicheng Technologies Limited

RO4350B + High Tg FR-4 Hybrid 6-Layer PCB with 1.6mm Thickness: A Cost-Effective High-Frequency Solution by Bicheng Technologies Limited

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

At Bicheng Technologies Limited, we are proud to offer high-performance hybrid PCBs that combine the strengths of Rogers RO4350B high-frequency laminates and High-Tg FR-4 materials. Our RO4350B + High-Tg FR-4 Hybrid 6-Layer PCB is specifically designed for applications that demand excellent signal integrity, thermal reliability, and cost efficiency.

This 1.6mm PCB, with immersion silver surface finish and 6-layer construction, is an ideal solution for RF, microwave, and high-frequency designs. By strategically using RO4350B for critical high-frequency sections and FR-4 for low-frequency or power sections, this hybrid PCB ensures optimized performance at a competitive price.

Let’s explore the construction, advantages, and applications of this advanced hybrid PCB.

1. Overview of the RO4350B + High Tg FR-4 Hybrid 6-Layer PCB

The RO4350B + High Tg FR-4 Hybrid PCB combines the high-frequency stability of Rogers RO4350B with the mechanical strength and cost-efficiency of High-Tg FR-4. This hybrid design allows engineers to achieve precise impedance control and low signal loss in RF sections while maintaining thermal reliability and structural integrity in the PCB’s overall construction.

The RO4350B laminate is known for its low dielectric constant (Dk) and low dissipation factor (Df), making it ideal for antenna designs, RF circuits, and microwave components. Meanwhile, the High-Tg FR-4 material enhances the PCB’s heat resistance and dimensional stability, ensuring reliable performance even in harsh environments.

At Bicheng Technologies Limited, all our PCBs are manufactured to IPC-Class-2 standards and undergo rigorous 100% electrical testing to ensure consistent quality and reliability.

PCB Construction Details

Here is an in-depth look at the construction specifications of this hybrid PCB:

The 6-layer stackup ensures excellent signal integrity, thermal performance, and mechanical reliability, making it suitable for high-frequency communication systems.

2. Features and Material Properties

This hybrid PCB benefits from the unique properties of RO4350B laminates and High-Tg FR-4 materials, creating a cost-effective solution that doesn’t compromise on performance.

RO4350B Properties and Features:

• Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz, ensuring stable and predictable signal propagation.
• Dissipation Factor (Df): 0.0037 at 10GHz, minimizing signal loss and maximizing efficiency.
• Thermal Expansion: Z-axis CTE: 32ppm/°C, ensuring compatibility with copper and minimizing delamination risks.
• Thermal Conductivity: 0.69 W/m/°K, enabling efficient heat dissipation.
• Moisture Absorption: Low moisture absorption of 0.06%, ensuring reliable performance in humid environments.

High-Tg FR-4 Properties and Features:

• Tg Value: ≥170°C, making it suitable for lead-free soldering and high-temperature applications.
• Mechanical Strength: Excellent rigidity and compatibility with multilayer stackups.
• Cost Efficiency: A traditional epoxy/fiberglass system, offering low cost for low-frequency sections.
• Dimensional Stability: Low Z-axis CTE improves through-hole reliability and structural integrity.

3. Key Advantages of Using a Hybrid PCB

Performance Optimization

• Signal Integrity: RO4350B ensures low signal loss and minimal delay in high-frequency circuits, such as antennas and RF traces.
• Impedance Control: Tight Dk tolerance (±0.05) ensures accurate impedance matching in critical high-frequency designs.

Thermal Management and Reliability

• High-Temperature Endurance: High-Tg FR-4 handles high temperatures, while RO4350B minimizes thermal stress with its low CTE.
• UL Certification: RO4350B is UL 94 V-0 rated, ensuring flame resistance and safety.

Cost and Manufacturing Efficiency

• Selective Material Use: RO4350B is strategically used only in high-frequency areas, reducing material costs.
• Standard Processing: Both materials are compatible with standard FR-4 manufacturing processes, eliminating the need for specialized equipment.

4. Applications of the RO4350B + High Tg FR-4 Hybrid PCB

The RO4350B + High Tg FR-4 Hybrid PCB is widely used in industries that demand high signal integrity, thermal reliability, and cost-effective solutions.

Typical Applications:

1. Cellular Base Station Antennas and Power Amplifiers
2. RF Identification Tags (RFID)
3. Automotive Radar and Sensors
4. LNBs for Direct Broadcast Satellites

Why Choose Bicheng Technologies Limited?

At Bicheng Technologies Limited, we are committed to providing innovative PCB solutions that meet the needs of high-performance industries. The RO4350B + High Tg FR-4 Hybrid PCB exemplifies our expertise in combining high-frequency performance with mechanical reliability.

Every PCB we manufacture undergoes stringent 100% electrical testing to ensure consistent quality and reliability. With worldwide availability and adherence to IPC-Class-2 standards, we are your trusted partner for high-performance PCB projects.

For technical inquiries or to place an order, feel free to contact me, Sally, at sales30@bichengpcb.com. I’ll be delighted to assist you with your high-frequency PCB needs.

RO4350B + High Tg FR-4 Hybrid 6-Layer PCB with 1.6mm Thickness by Bicheng Technologies Limited