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Wngling low DK 2.55 F4BTMS255 Copper Clad Laminate Aerospace-Grade High-Frequency Material

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Wngling low DK 2.55 F4BTMS255 Copper Clad Laminate Aerospace-Grade High-Frequency Material

MOQ:	1 pz
prezzo:	0.99-99USD/PCS
imballaggio standard:	imballaggio
Periodo di consegna:	2-10 giorni lavorativi
metodo di pagamento:	T/T, Paypal
Capacità di approvvigionamento:	50000 pezzi

Informazione dettagliata

Descrizione del prodotto

Informazione dettagliata

Luogo di origine

Marca

Rogers

Certificazione

ISO9001

Numero di modello

RT/Duroid 5880

Quantità di ordine minimo:

Prezzo:

0.99-99USD/PCS

Imballaggi particolari:

imballaggio

Tempi di consegna:

2-10 giorni lavorativi

Termini di pagamento:

T/T, Paypal

Capacità di alimentazione:

50000 pezzi

Descrizione del prodotto

F4BTMS255 Copper Clad Laminate: Aerospace-Grade High-Frequency Material

Taizhou Wangling Company presents the F4BTMS255, a premium PTFE-based laminate engineered for the most demanding high-frequency applications. As part of our advanced F4BTMS series, this material represents a significant technological breakthrough—combining ultra-thin, ultra-fine glass fabric reinforcement with homogeneous dispersion of specialty nano-ceramic fillers. The result is an aerospace-grade material that delivers exceptional electrical performance, dimensional stability, and reliability for mission-critical applications.

Material Technology
The F4BTMS255 incorporates several innovative features that set it apart from conventional PTFE laminates:

Ultra-Thin, Ultra-Fine Glass Fabric: Minimal glass fiber content reduces the "glass weave effect" on electromagnetic wave propagation, ensuring consistent signal integrity
Nano-Ceramic Filler Technology: Large volumes of uniformly dispersed ceramic particles enhance thermal conductivity and mechanical stability
RTF Low-Roughness Copper Foil: Standard reverse treated copper foil minimizes conductor loss while maintaining excellent peel strength

Electrical Performance
The F4BTMS255 features a dielectric constant (Dk) of 2.55 ±0.04 at 10 GHz, with identical design value ensuring predictable impedance control. The dissipation factor (Df) is exceptionally low:

0.0012 at 10 GHz
0.0013 at 20 GHz
0.0016 at 40 GHz

This ultra-low loss performance extends usability to 40 GHz and beyond, with stable dielectric properties that support phase-sensitive applications.

The thermal coefficient of dielectric constant is -92 ppm/°C from -55°C to 150°C, ensuring stable electrical performance across a wide operating temperature range. Volume and surface resistivity both exceed 1 × 10⁸ MΩ, providing excellent insulation characteristics.

F4BTMS series Data Sheet

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Surface Resistivity	Standard Condition	MΩ	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Electrical Strength (Z direction)	5KW,500V/s	KV/mm	>26	>30	>32	>34	>40	>40	>42	>44	>45	>48	>23
Breakdown Voltage (XY direction)	5KW,500V/s	KV	>35	>38	>40	>42	>48	>52	>55	>52	>54	>55	>42
Coefficientof Thermal Expansion (X, Y direction)	-55 º~288ºC	ppm/ºC	40, 50	35, 40	15, 20	15, 20	10, 12	10, 11	10, 12	13, 12	12, 12	10, 12	16, 18
Coefficientof Thermal Expansion (Z direction)	-55 º~288ºC	ppm/ºC	290	220	80	72	22	22	20	47	45	40	32
Thermal Stress	260℃, 10s,3 times	/	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination
Water Absorption	20±2℃, 24 hours	%	0.02	0.02	0.025	0.025	0.02	0.025	0.03	0.08	0.08	0.1	0.03
Density	Room Temperature	g/cm3	2.18	2.22	2.26	2.26	2.25	2.28	2.3	2.51	2.53	2.75	3.2
Long-Term Operating Temperature	High-Low Temperature Chamber	℃	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260
Thermal Conductivity	Z direction	W/(M.K)	0.26	0.28	0.31	0.36	0.58	0.58	0.6	0.63	0.64	0.67	0.81
Flammability	/	UL-94	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
Material Composition	/	/	PTFE,Ultra-thin and ultra-fine (quartz) fiberglass.		PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.

Thermal Performance:

Coefficient of Thermal Expansion (CTE): 15-20 ppm/°C (X/Y direction), 80 ppm/°C (Z direction)

Thermal Conductivity: 0.31 W/(m·K)—superior heat dissipation for power applications

Decomposition Temperature: Exceptional thermal stability

Thermal Stress: Withstands 260°C for 10 seconds over three cycles without delamination

Mechanical Excellence:

Copper Peel Strength: >1.8 N/mm with 1 oz RTF copper

Low Moisture Absorption: 0.025%, ensuring consistent performance in humid environments

Density: 2.26 g/cm³

Flammability Rating: UL 94 V-0

Aerospace-Grade Reliability
The F4BTMS255 is specifically engineered for high-reliability applications:

Low Outgassing: Meets vacuum outgassing requirements for space applications
Radiation Resistance: Maintains stable dielectric and mechanical properties after irradiation exposure
Excellent Dimensional Stability: Minimal expansion/contraction during thermal cycling
Superior Plated Through-Hole Reliability: Low Z-axis CTE ensures reliable interconnects

F4BTMS255 Typical Applications

Aerospace and space equipment (on-board and cabin systems)

Military and defense radar systems

Phased array antennas and phase-sensitive antenna arrays

Feed networks

Satellite communications

Microwave and RF components

Processing and Fabrication
The F4BTMS255 is designed for manufacturability using standard PTFE fabrication techniques:

Standard PCB Processing: Compatible with conventional PTFE circuit board processes
Multi-Layer Capability: Excellent mechanical properties support multi-layer and backplane fabrication
Fine Feature Processing: Superior machinability for dense hole patterns and fine-line circuits
Plated Through-Hole: Reliable via processing with standard plating methods
Metal-Backed Options: Available with aluminum or copper backing for enhanced thermal management or shielding

Copper Foil:

Standard: RTF low-roughness copper, 0.5 oz (0.018mm) and 1 oz (0.035mm)

Optional: 50Ω embedded resistor foil (nickel-phosphorus alloy, 0.2μm thickness)

Panel Sizes:

305 × 460mm (12" × 18")

460 × 610mm (18" × 24")

610 × 920mm (24" × 36")

Custom sizes available upon request

Dielectric Thickness:

Minimum thickness: 0.127mm (5.0 mil)

Available in 0.127mm multiples

Custom thicknesses available

Metal-Backed Configurations:

F4BTMS255-AL: Aluminum-backed for lightweight thermal management

F4BTMS255-CU: Copper-backed for maximum heat dissipation

Production Capabilities and Quality Assurance

As a specialized manufacturer of PTFE-based circuit materials, we maintain rigorous quality control throughout the production process:

Advanced Manufacturing: Precision resin impregnation, nano-ceramic dispersion, and high-temperature lamination technologies

Production Capacity: Scalable manufacturing to support both prototype and high-volume requirements

Quality Testing: All materials tested in accordance with IPC-TM-650 and GB/T standards

Lot Traceability: Complete material traceability for quality assurance

Storage:

Store in clean, dry environment at 10°C to 35°C

Maintain relative humidity below 70%

Keep in original packaging until use

Avoid direct sunlight, corrosive gases, and extreme temperature fluctuations

Store panels flat to prevent warpage

Recommended shelf life: 12 months under proper conditions

Transportation:

Protective interleaving prevents surface damage

Secure edge protection minimizes transit damage

Moisture-barrier packaging for humidity protection

Multiple packaging options for domestic and international shipping

Compliant with international electronic material shipping regulations

Why Choose F4BTMS255?
The F4BTMS255 combines the proven reliability of PTFE-based technology with advanced nano-ceramic filler and ultra-fine glass fabric reinforcement. Its exceptional electrical stability, low loss, aerospace-grade reliability, and excellent processability make it the ideal choice for designers seeking high-performance materials for mission-critical RF applications.

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Wngling low DK 2.55 F4BTMS255 Copper Clad Laminate Aerospace-Grade High-Frequency Material

MOQ:	1 pz
prezzo:	0.99-99USD/PCS
imballaggio standard:	imballaggio
Periodo di consegna:	2-10 giorni lavorativi
metodo di pagamento:	T/T, Paypal
Capacità di approvvigionamento:	50000 pezzi

Informazione dettagliata

Descrizione del prodotto

Informazione dettagliata

Luogo di origine

Cina

Marca

Rogers

Certificazione

ISO9001

Numero di modello

RT/Duroid 5880

Quantità di ordine minimo:

1 pz

Prezzo:

0.99-99USD/PCS

Imballaggi particolari:

imballaggio

Tempi di consegna:

2-10 giorni lavorativi

Termini di pagamento:

T/T, Paypal

Capacità di alimentazione:

50000 pezzi

Descrizione del prodotto

F4BTMS255 Copper Clad Laminate: Aerospace-Grade High-Frequency Material

Material Technology
The F4BTMS255 incorporates several innovative features that set it apart from conventional PTFE laminates:

Ultra-Thin, Ultra-Fine Glass Fabric: Minimal glass fiber content reduces the "glass weave effect" on electromagnetic wave propagation, ensuring consistent signal integrity
Nano-Ceramic Filler Technology: Large volumes of uniformly dispersed ceramic particles enhance thermal conductivity and mechanical stability
RTF Low-Roughness Copper Foil: Standard reverse treated copper foil minimizes conductor loss while maintaining excellent peel strength

0.0012 at 10 GHz
0.0013 at 20 GHz
0.0016 at 40 GHz

This ultra-low loss performance extends usability to 40 GHz and beyond, with stable dielectric properties that support phase-sensitive applications.

F4BTMS series Data Sheet

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	F4BTMS220	F4BTMS233	F4BTMS255	F4BTMS265	F4BTMS294	F4BTMS300	F4BTMS350	F4BTMS430	F4BTMS450	F4BTMS615	F4BTMS1000
Dielectric Constant (Typical)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.00	3.50	4.30	4.50	6.15	10.20
Dielectric Constant Tolerance	/	/	±0.02	±0.03	±0.04	±0.04	±0.04	±0.04	±0.05	±0.09	±0.09	±0.12	±0.2
Dielectric Constant (Design)	10GHz	/	2.2	2.33	2.55	2.65	2.94	3.0	3.50	4.3	4.5	6.15	10.2
Loss Tangent (Typical)	10GHz	/	0.0009	0.0010	0.0012	0.0012	0.0012	0.0013	0.0016	0.0015	0.0015	0.0020	0.0020
	20GHz	/	0.0010	0.0011	0.0013	0.0014	0.0014	0.0015	0.0019	0.0019	0.0019	0.0023	0.0023
	40GHz	/	0.0013	0.0015	0.0016	0.0018	0.0018	0.0019	0.0024	0.0024	0.0024	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	-130	-122	-92	-88	-20	-20	-39	-60	-58	-96	-320
Peel Strength	1 OZ RTF copper	N/mm	>2.4	>2.4	>1.8	>1.8	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2	>1.2
Volume Resistivity	Standard Condition	MΩ.cm	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Surface Resistivity	Standard Condition	MΩ	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8	≥1×10^8
Electrical Strength (Z direction)	5KW,500V/s	KV/mm	>26	>30	>32	>34	>40	>40	>42	>44	>45	>48	>23
Breakdown Voltage (XY direction)	5KW,500V/s	KV	>35	>38	>40	>42	>48	>52	>55	>52	>54	>55	>42
Coefficientof Thermal Expansion (X, Y direction)	-55 º~288ºC	ppm/ºC	40, 50	35, 40	15, 20	15, 20	10, 12	10, 11	10, 12	13, 12	12, 12	10, 12	16, 18
Coefficientof Thermal Expansion (Z direction)	-55 º~288ºC	ppm/ºC	290	220	80	72	22	22	20	47	45	40	32
Thermal Stress	260℃, 10s,3 times	/	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination	No delamination
Water Absorption	20±2℃, 24 hours	%	0.02	0.02	0.025	0.025	0.02	0.025	0.03	0.08	0.08	0.1	0.03
Density	Room Temperature	g/cm3	2.18	2.22	2.26	2.26	2.25	2.28	2.3	2.51	2.53	2.75	3.2
Long-Term Operating Temperature	High-Low Temperature Chamber	℃	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260
Thermal Conductivity	Z direction	W/(M.K)	0.26	0.28	0.31	0.36	0.58	0.58	0.6	0.63	0.64	0.67	0.81
Flammability	/	UL-94	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0	V-0
Material Composition	/	/	PTFE,Ultra-thin and ultra-fine (quartz) fiberglass.		PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.

Thermal Performance:

Coefficient of Thermal Expansion (CTE): 15-20 ppm/°C (X/Y direction), 80 ppm/°C (Z direction)

Thermal Conductivity: 0.31 W/(m·K)—superior heat dissipation for power applications

Decomposition Temperature: Exceptional thermal stability

Thermal Stress: Withstands 260°C for 10 seconds over three cycles without delamination

Mechanical Excellence:

Copper Peel Strength: >1.8 N/mm with 1 oz RTF copper

Low Moisture Absorption: 0.025%, ensuring consistent performance in humid environments

Density: 2.26 g/cm³

Flammability Rating: UL 94 V-0

Aerospace-Grade Reliability
The F4BTMS255 is specifically engineered for high-reliability applications:

Low Outgassing: Meets vacuum outgassing requirements for space applications
Radiation Resistance: Maintains stable dielectric and mechanical properties after irradiation exposure
Excellent Dimensional Stability: Minimal expansion/contraction during thermal cycling
Superior Plated Through-Hole Reliability: Low Z-axis CTE ensures reliable interconnects

F4BTMS255 Typical Applications

Aerospace and space equipment (on-board and cabin systems)

Military and defense radar systems

Phased array antennas and phase-sensitive antenna arrays

Feed networks

Satellite communications

Microwave and RF components

Processing and Fabrication
The F4BTMS255 is designed for manufacturability using standard PTFE fabrication techniques:

Standard PCB Processing: Compatible with conventional PTFE circuit board processes
Multi-Layer Capability: Excellent mechanical properties support multi-layer and backplane fabrication
Fine Feature Processing: Superior machinability for dense hole patterns and fine-line circuits
Plated Through-Hole: Reliable via processing with standard plating methods
Metal-Backed Options: Available with aluminum or copper backing for enhanced thermal management or shielding

Copper Foil:

Standard: RTF low-roughness copper, 0.5 oz (0.018mm) and 1 oz (0.035mm)

Optional: 50Ω embedded resistor foil (nickel-phosphorus alloy, 0.2μm thickness)

Panel Sizes:

305 × 460mm (12" × 18")

460 × 610mm (18" × 24")

610 × 920mm (24" × 36")

Custom sizes available upon request

Dielectric Thickness:

Minimum thickness: 0.127mm (5.0 mil)

Available in 0.127mm multiples

Custom thicknesses available

Metal-Backed Configurations:

F4BTMS255-AL: Aluminum-backed for lightweight thermal management

F4BTMS255-CU: Copper-backed for maximum heat dissipation

Production Capabilities and Quality Assurance

As a specialized manufacturer of PTFE-based circuit materials, we maintain rigorous quality control throughout the production process:

Advanced Manufacturing: Precision resin impregnation, nano-ceramic dispersion, and high-temperature lamination technologies

Production Capacity: Scalable manufacturing to support both prototype and high-volume requirements

Quality Testing: All materials tested in accordance with IPC-TM-650 and GB/T standards

Lot Traceability: Complete material traceability for quality assurance

Storage:

Store in clean, dry environment at 10°C to 35°C

Maintain relative humidity below 70%

Keep in original packaging until use

Avoid direct sunlight, corrosive gases, and extreme temperature fluctuations

Store panels flat to prevent warpage

Recommended shelf life: 12 months under proper conditions

Transportation:

Protective interleaving prevents surface damage

Secure edge protection minimizes transit damage

Moisture-barrier packaging for humidity protection

Multiple packaging options for domestic and international shipping

Compliant with international electronic material shipping regulations